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Foxconn Technology Group, a globally leading electronics manufacturing company, is now hiring a SMT Process Experiment Engineer.
Lead reliability test analysis of SMT (surface mounting technology, Consumer Electronics Industry), such as cross secion/Dye&pry/shear/pull/torsion/FT-IR etc.
Experimental anomaly analysis SMT process defects, such as void, crack, cold solder using SEM/EDS and optical microscopy, data support for process optimization and quality improvement and collaborate with DFM teams to improve designs based on failure mode data.
Develop test methodologies for new materials (low temperature solders, Flex PCBs).
Responsibilities
Duties and Responsibilities
Lead SMT reliability test and analysis: such as cross-section, Dye&pry, shearpulltorsion, FT-IR etc
Preparation SMT reliability test report
Maintenance experimental equipment
Manage and training operation technicians
Optimize reliability test processes and methods to improve efficiency and accuracy
Lead Line-qualification of SMT lines and progress tracking
Education And Work Experience
Educational Requirements: Bachelor's degree or above
Work Experience (Nice-to-Have): Preference is given to those with relevant work experience, and outstanding recent graduates are also eligible to apply.
Working conditions
Join a high-growth, innovation-driven team shaping next-gen consumer electronics
Work at the intersection of engineering, automation, and global operations
Modern, collaborative offices or labs with flexible setups emphasizing innovation and teamwork
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Seniority level
Mid-Senior level
Employment type
Full-time
Job function
Engineering and Information Technology
Industries
Internet Publishing
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