Trends in Electronics Technology

GPS Just Became Optional for Military Navigation. Quantum Sensors Are Why. SandboxAQ flies magnetic navigation on C-17s. Centimeter accuracy without satellites. Q-CTRL's sensors beat classical systems by 111x in flight tests. Not in labs. Actual aircraft. When China jams GPS tomorrow, these systems keep working. The physics is simple. Earth's magnetic field becomes your navigation chart. Quantum magnetometers detect submarine signatures at ranges that change naval warfare. Gravity variations expose underground bunkers. Three companies own this space. • SandboxAQ: Spun from Alphabet, MagNav for GPS-denied ops • Q-CTRL: $24.4M DARPA contracts, ruggedized for subs • Infleqtion: Cold atoms, femtometer precision gravimeters Traditional INS drifts meters per hour. Quantum INS doesn't drift. Period. Boeing integrated quantum-classical hybrid nav in 2025 tests. Sub-atomic precision achieved. Australian Navy trials validated submarine detection. UK Dstl hunts subs with quantum magnetometers. Quantum computing debates 2035 timelines. Quantum sensing deploys in 2-5 years. Miniaturization remains the challenge. SWaP reduction for drone integration needs solutions. But DARPA's RoQS program funds it. Army Research Lab develops Rydberg RF sensors. Money flows to near-term capability. Applications today. • Navigate polar regions where GPS fails • Detect underground facilities via gravity • Hunt submarines at extended ranges • Operate beyond satellite coverage Russia spoofs GPS over Ukraine daily. China jams signals in contested waters. Traditional navigation fails. Quantum navigation doesn't care. While everyone waits for quantum computers, quantum sensors deliver battlefield advantage now.

What are current Trends and Challenges in Semiconductor Packaging — and Why It’s Becoming a Key Differentiator ✅ Why Packaging Matters More Than Ever Traditionally, packaging was seen as a final step—just to protect the chip. Today, it’s strategic and performance-critical, especially as Moore’s Law slows and heterogeneous integration gains momentum. Packaging now enables power, speed, and form factor optimizations that silicon scaling alone cannot deliver. 🔄 Current Trends in Semiconductor Packaging 1. 📦 Chiplet Architectures / Heterogeneous Integration • Instead of one monolithic die, multiple smaller dies (“chiplets”) are packaged together. • Benefits: Yield improvement, modular design, integration of different nodes/materials. • Examples: AMD’s EPYC CPUs, Intel’s Foveros and EMIB. 2. 🔁 2.5D & 3D Packaging • 2.5D: Multiple dies mounted side-by-side on an interposer. • 3D: Stacked dies with through-silicon vias (TSVs) enabling vertical interconnects. • Advantage: Higher bandwidth, smaller footprint, lower latency. 3. 🌡️ Advanced Thermal Management • Power-dense chips like GPUs/AI accelerators generate huge heat. • Packaging integrates advanced cooling (e.g., embedded heat spreaders, microfluidics). 4. 🧩 System-in-Package (SiP) & Wafer-Level Packaging (WLP) • Complete systems integrated within a single package. • Used in smartphones, wearables, and IoT. 5. ⚙️ Integration of Photonics and RF • Packages now include RF front ends, photonic interconnects for high-speed comms. • Crucial for 5G, datacenter optics. 6. 🌍 AI/Edge/Automotive Driving Demand • Harsh environments and low-latency requirements demand rugged, efficient packaging with high reliability. ⚠️ Challenges in Semiconductor Packaging 1. 💰 Cost and Complexity • Advanced packaging techniques (like 3D stacking) are expensive and not yet easily scalable. • Fine-pitch interconnects require ultra-clean environments and tight process control. 2. 📉 Yield and Reliability • Stacked dies and TSVs increase failure risks. • Debugging multi-die systems is much harder than monolithic chips. 3. 📏 Standardization Issues • No universal interface standard for chiplets (UCIe is emerging but adoption is slow). • Proprietary packaging limits ecosystem interoperability. 4. 📚 Skills Gap • Packaging design requires knowledge of materials science, signal integrity, thermals, and mechanical engineering. • There’s a talent shortage in this niche. 🌟 Why It’s a Key Differentiator Now • Performance Boosts: Faster interconnects and lower power loss. • Integration of Diverse Functions: Analog + digital + memory + sensors in one module. • Time to Market: Modular chiplets enable quicker development and iteration. • Customization: Tailor-made solutions for AI, automotive, edge devices. If you are looking to invest in semi and need expert consulting, drop us a DM.

The AI hype cycle is fading, but its prevalence is only set to grow.    As I shared with Rocio Fabbro at Quartz, AI is becoming less of a rising star and more of a behind-the-scenes operator that’ll quietly (but significantly) influence how organizations think about every process, product, and decision.    We’re at an inflection point where AI is poised to evolve much like electricity 💡: invisible in our daily lives but powering everything. It won’t be about if AI is being used -- but how it’s driving transformation across industries.    Here’s what else is ahead according to Deloitte’s 2025 Tech Trends (https://deloi.tt/3BYn523):    🤖 AI Everywhere: We’re moving from experimentation to operationalization, with AI embedded into other major innovations—spanning customer service, supply chains, product development, and beyond.    📊 Fusing Small and Large Language Models: It’s not a matter of “either/or” between large and small language models—it's both. Organizations are combining the right models to address business needs.    🖥️ Practical Applications for Quantum Computing: From post-quantum cryptography to solving problems beyond the limits of traditional computing, the horizon is expanding. The AI of 2025 will be smarter, more focused, and deeply integrated into everything we do – albeit more quietly. The hype may fade, but the impact is just beginning! 

Imagine this: You're watching a long video, maybe a concert or a sporting event. Now, imagine that video isn't just a flat image, but a 3D recording where you can look around and see the scene from any angle. That's a "volumetric video," and storing them can be a huge challenge. This research shows how AI can make these 3D videos much smaller and easier to handle. Think of it like this: the video isn't just one big chunk of data. Instead, the AI breaks it down into smaller pieces and figures out which parts are changing quickly and which parts are staying the same. This allows for much more efficient storage. The result? You can enjoy longer 3D videos with the same amazing quality, without needing massive amounts of storage space. This could lead to incredible new experiences in virtual reality and beyond. This research ''Temporal Gaussian Hierarchy'' was conducted by a team from Zhejiang University, Stanford University, and HKUST, and is published in ACM Transactions on Graphics. Follow me Endrit Restelica for more tech stuff.

In Deloitte's 16th annual Tech Trends report, AI emerges as the unifying thread across nearly every trend, poised to become an integral part of the foundational fabric of how we operate and innovate moving forward. 🤖✨ Here's a snapshot of the innovations that are set to redefine the way businesses operate: • ⚡ AI as an Essential Utility: Much like electricity, AI is becoming an indispensable part of daily operations, reshaping the way businesses function and innovate. What's next for AI? Leverage tailored AI models, from small language models to agentic AI, to optimize specific business needs efficiently. • 💻 Hardware is eating the world: Invest in advanced chips to power AI workloads and enable smarter IoT devices and robotics across industries. • 🚀 IT, amplified - AI elevates the reach (and remit) of the tech function: Transform IT into a strategic enabler by automating tasks and innovating across infrastructure, talent, and delivery. • 🔒 Solving cryptography in an age of quantum: Prepare now for quantum-driven cybersecurity threats with post-quantum encryption and updated cryptographic practices. • 🛠️ AI changes everything for core modernization: Core systems providers have invested heavily in AI, rebuilding their offerings and capabilities around an AI-fueled or AI-first model. 📖 Explore the full report for a deep dive into these trends: Deloitte Tech Trends 2025 (https://lnkd.in/gWz84WwJ) Let's shape the future together—how is your organization preparing for these tech transformations? Share your thoughts in the comments! 💡👇 #TechTrends2025 #GenerativeAI #DigitalTransformation #Innovation #FutureOfWork #DeloitteInsights

Chinese scientists have developed a next-generation electronic warfare system powered by 6G technology, capable of jamming advanced radar systems and transmitting battlefield data across over 300 platforms. Led by Professor Deng Lei of Huazhong University of Science and Technology, the system is the first publicly confirmed platform to achieve simultaneous same-frequency full-duplex communication and jamming, using a compact, multifunctional architecture. Backed by $10 million in funding, the 6G device integrates microwave photonics to generate over 3,600 false targets, spoof enemy radar, and reinforce China’s lead in global 6G military applications.

In our race to electrify, utilities face a tough reality: infrastructure is aging, budgets are tight, and timelines are long. But what if we could unlock flexibility and intelligence within the grid we already have? In an insightful interview with Smart Energy International, my colleague Arnaud Cantin explores how virtual substations are transforming how distribution systems operators (DSOs) plan, operate, and innovate. ➡️ https://lnkd.in/escehent He points to three technological shifts reshaping the future of power management: 1️⃣ Virtualization brings real-time flexibility and intelligence at the grid edge. 2️⃣ Digital twins and AI reduce risk and accelerate deployment. 3️⃣ Software-defined power enables scalable, resilient, and efficient operations. Together, these digital capabilities are redefining what’s possible without waiting for new infrastructure to catch up. Watch the video interview at the link above to learn more. 💬 What’s one challenge you see in accelerating grid modernization—and how are you tackling it? Share your ideas in the comments below. #EnergyTransition #Utilities #GridModernization

Some of the key technology trends of 2025 to watch: 1. AI & ML - Generative AI: AI models are being integrated into businesses for content creation, customer service, and decision-making. - AI Regulation: Governments are introducing regulations to ensure responsible AI development, focusing on bias, ethics, and transparency. - AI-Powered Automation: AI is increasingly automating complex tasks in industries like healthcare, manufacturing etc. 2. Edge and Quantum Computing - Edge Computing: Processing data at the device level (e.g., IoT sensors) is reducing latency and improving real-time analytics. - Quantum Breakthroughs: Progress in quantum computing is enabling breakthroughs in cryptography, materials science, and drug discovery. 3. Web3 and Blockchain - Decentralized Applications: Web3 platforms are reshaping finance, gaming, and supply chains using blockchain. - Tokenization: Assets like real estate and art are increasingly tokenized, making them accessible to a broader audience. 4. Immersive Technologies - Extended Reality (XR): The fusion of VR, AR, and MR (Mixed Reality) is transforming education, training, and entertainment. - Metaverse: Still evolving 5. Sustainability Technologies - Green Tech: Innovations in renewable energy (solar, wind, hydrogen). - Carbon Capture: New technologies are capturing CO₂ emissions - Circular Economy: Tech-driven recycling solutions are reducing waste 6. 5G and Beyond - 6G Development: Research on 6G networks - IoT Expansion 7. Biotechnology and Health Tech - CRISPR and Gene Editing: Advances in gene-editing technologies - Personalized Medicine: AI is tailoring treatments to individual patients, improving efficacy. - Wearables and Remote Monitoring: Devices are enabling real-time health 8. Cybersecurity Innovations - Zero-Trust Architecture: Companies are adopting zero-trust models for data & networks. - AI in Cybersecurity: AI-powered tools are identifying and mitigating threats in real-time. - Quantum-Resistant Cryptography: Preparing for the eventual threat of quantum computing to current encryption standards. 9. Robotics and Automation - Humanoid Robots: Advanced robots for various roles - Drones and Autonomous Systems: Used in delivery, agriculture, and disaster management. - Collaborative Robots (Cobots): These robots work alongside humans, enhancing productivity in industries. 10. Space Exploration and Technology - Commercial Space Ventures: Private companies are leading in satellite launches, space tourism - Deep Space Missions: NASA, ESA, and other agencies are focusing on Mars and deep space 11. Ethics and Digital Governance - Tech Regulation: Governments are balancing innovation with the need for privacy, security, and fair use. - Digital Identity: New standards for digital IDs and privacy are emerging. These trends indicate a future of interconnected, intelligent, and sustainable technologies !

🚀 The Future is Now: AI beyond the hype We are living in a time when decades seem to happen in weeks. J.P. Morgan’s latest “Tech Trends 2025” report unpacks how AI will redefine business, security, and human potential. 💡 The what: 🔸 Innovative Products & Experiences: This includes AI-generated videos and avatars, voice AI agents, generative engine optimization (GEO), adtech automation, AI-driven coaching, on-device AI, and agentic financial transactions. These trends focus on enhancing user experiences and operational efficiency. 🔸 Delivering Data & AI/ML at Scale: Highlights include inference-time compute, synthetic data, retrieval augmented generation (RAG), multi-agent systems, and automation platforms, emphasizing scalability and performance improvements. 🔸 Technology Modernization: Covers next-gen data center designs, AI platforms-as-a-service (PaaS), AI workload orchestration, agentic software development, and bring your own cloud (BYOC), focusing on infrastructure and development enhancements. 🔸 Protect the Firm: Focuses on securing agentic applications, detecting deepfakes, agentic cybersecurity operations, and confidential AI, addressing security and privacy concerns. 💡 So what: 🔹 Agentic Autonomy: AI agents are evolving from single-task tools to collaborative multi-agent systems that handle complex workflows, like autonomous financial transactions and cross-functional research. The future isn't just automated; it’s orchestrating itself. 🔹 On-Device Intelligence: Processing AI locally (phones, laptops, IoT) slashes latency, boosts privacy, and unlocks real-time decision-making—offline. No more cloud dependencies. 🔹 Confidential AI: Trust issues? New hardware-secured enclaves (TEEs) protect sensitive data during AI processing, enabling secure collaboration without exposure. 🔹 Deepfake Arms Race: As synthetic videos/ voices explode, detection tools and verified credentials (C2PA standards) become non-negotiable for brand integrity. 💡 Why it matters: "The next frontier isn’t just scaling AI—it’s about ethical scalability. From data centers cooled by nuclear power to AI coaches revolutionizing talent development, we’re building ecosystems, not silos." 📌 Actionable Insight: Geo-optimize your content for AI search engines (Generative Engine Optimization) or get buried by algorithms. 📊 Dive Deeper: Explore J.P. Morgan’s full analysis here. #AIRevolution #TechTrends2025 #FutureOfWork #ArtificialIntelligence #Innovation #DigitalTransformation #MachineLearning #CyberSecurity #FinTech #EthicalAI

🟪SemiVision : The transistor scaling roadmap is undergoing a paradigm shift. Gate-All-Around (GAA) 1st Gen at 2nm (2025) marks the entry into nanosheet architecture, followed by GAA 2nd Gen (1.4nm, 2027) integrating backside power delivery (BSPD) to improve routing efficiency and power integrity. By GAA 3rd Gen (1.0nm, 2029), advanced MIMCAP structures will be co-optimized with nanosheets for enhanced performance and density. The ultimate milestone is CFET (0.7nm, 2031), which vertically stacks NMOS and PMOS devices, breaking the 2D scaling barrier and enabling new design possibilities in performance, power, and area (PPA). This evolution highlights the industry’s trajectory toward increasingly complex 3D device architectures, driven by both physics limits and system-level scaling requirements. Source: ASM